1. Moralo Customization
Likaroloana:
Moralo oa Parametric: Bareki ba ka hlakisa lisebelisoa tsa ho cheka (HSS, carbide, e koahetsoeng ka taemane, joalo-joalo), li-angles tsa lintlha, palo ea lekolilo, bophara ba bophara (li-micro bits 0.1mm ho ea ho li-drill tse boima ba 50mm+), le bolelele.
Ntlafatso e Ikhethang ea Kopo: Meetso e tloahelehileng ea tšepe, lehong, konkreite, PCB, joalo-joalo (mohlala, lekolilo tse ngata bakeng sa ho qeta, phala e le 'ngoe bakeng sa ho ntša chip).
Tšehetso ea CAD/CAM: ponelopele ea mohlala oa 3D, tlhahlobo ea DFM (Design for Manufacturing, le STEP/IGES file import.
Litlhoko tse Khethehileng: Li-shank tse sa tloaelehang (mohlala, li-taper tse tloaelehileng tsa Morse, li-interfaces tse fetohang kapele), masoba a pholileng, meaho e senyang ho sisinyeha.
Litšebeletso:
- Therisano ea mahala ea tekheniki bakeng sa khetho ea thepa le ts'ebetso.
- Karabelo ea lihora tse 48 bakeng sa lintlafatso tsa moralo ka tšehetso e pheta-phetoang.
2. Contract Customization
Likaroloana:
Melao e feto-fetohang: MOQ e tlase (likotoana tse 10 tsa prototypes), litheko tse thehiloeng ho boleng, litumellano tsa nako e telele.
Tšireletso ea IP: NDA ea ho saena le ho rala thuso ea ho kenya patent.
Phase ea thomello: Mehato e hlakileng (mohlala, tumello ea tlhahiso ea matsatsi a 30 kamora lisampole).
Litšebeletso:
Ho saena konteraka ea lipuo tse ngata inthaneteng (CN/EN/DE/JP, joalo-joalo).
Tlhahlobo ea boikhethelo ea motho oa boraro (mohlala, litlaleho tsa SGS).
3. Mohlala oa Tlhahiso
Likaroloana:
Prototyping e Potlakileng: Mehlala e sebetsang e fanoa ka matsatsi a 3-7 ka likhetho tsa kalafo ea holim'a metsi (TiN coating, black oxide, joalo-joalo).
Netefatso ea Mekhoa e Mengata: Bapisa lisampole tsa laser-cut, fatše, kapa brazed.
Litšebeletso:
- Litefiso tsa sampole tse kentsoeng ho liodara tse tlang.
- Litlaleho tse tlatselletsang tsa liteko (bothata, data e felisitsoeng).
4. Manufacturing Customization
Likaroloana:
Tlhahiso e feto-fetohang: Li-batches tse tsoakiloeng (mohlala, chrome plating).
Taolo ea Boleng: SPC ea ts'ebetso e felletseng, tlhahlobo ea bohlokoa ea 100% (mohlala, microscope ea moeli).
Mekhoa e Khethehileng: Phekolo ea cryogenic bakeng sa ho hanyetsa ho roala, li-nano-coatings, li-logos tse ngotsoeng ka laser.
Litšebeletso:
- Lintlafatso tsa tlhahiso ea nako ea 'nete (lifoto / livideo).
- Litaelo tse potlakileng (phetoho ea lihora tse 72, + 20–30% tefiso).
5. Packaging Customization
Likaroloana:
Packaging ea indasteri: Li-tubes tsa PVC tse sa tsitsang tse nang le li-desiccants (li-export-grade anti-rust), li-cartons tse ngotsoeng ka kotsi (bakeng sa li-alloys tse nang le cobalt).
Sephutheloana sa Mabenkele: Likarete tsa blister tse nang le barcode, libuka tsa lipuo tse ngata (litataiso tsa lebelo/phepelo).
Branding: Mabokose a mebala a tloaelo, sephutheloana se ngotsoeng ka laser, lisebelisoa tse senyehang.
Litšebeletso:
- Laeborari ea ho paka template e nang le bopaki ba moralo oa lihora tse 48.
- Ho ngolla/kitting ka sebaka kapa SKU.
6. Ka mor'a-Thekiso Tšebeletso
Likaroloana:
Warranty: Phetolo ea mahala ea likhoeli tse 12 bakeng sa tšenyo eo e seng ea motho (ho peeling, ho robeha).
Tšehetso ea Theknoloji: Ho seha li-calculator tsa parameter, lithupelo tsa ho chorisa.
Lintlafatso tse tsamaellanang le data: Ntlafatso ea nako ea bophelo bohle ka maikutlo (mohlala, li-tweaks tsa geometry ea flute).
Litšebeletso:
- Nako ea karabo ea lihora tse 4; lisebelisoa tsa lehae bakeng sa bareki ba mose ho maoatle.
- Ho latela nako le nako ka lisebelisoa tse ntle (mohlala, matsoho a boro).
Litšebeletso tsa Keketso ea Boleng
Indasteri Tharollo: Mocheso o phahameng oa PDC bakeng sa ho cheka sebakeng sa oli.
VMI (The Vendor-Managed Inventory): Ho romelloa ka JIT ho tsoa matlong a polokelo a tlamiloeng.
Litlaleho tsa Carbon Footprint: Lintlha tsa phello ea tikoloho ea Lifecycle.
